The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Aug. 11, 2023
Applicant:
Nexperia B.v., Nijmegen, NL;
Inventors:
Erik Eltink, Nijmegen, NL;
Theo Ter Steeg, Nijmegen, NL;
Assignee:
Nexperia B.V., Nijmegen, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); B05C 5/02 (2006.01); H10P 72/78 (2026.01); H10W 70/04 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0448 (2026.01); B05C 5/02 (2013.01); H10P 72/0428 (2026.01); H10P 72/78 (2026.01); H10W 70/048 (2026.01);
Abstract
This disclosure relates to an adhesive dispense unit for a semiconductor die bonding apparatus. The adhesive dispense unit includes an adhesive dispense nozzle and a pin member; the pin member comprising a down stand portion and a sheath portion, and the down stand is reciprocatable within the sheath portion.