The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jan. 04, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Bongyong Lee, Suwon-si, KR;

Taeyoung Kim, Suwon-si, KR;

Hyunmog Park, Suwon-si, KR;

Siyeon Cho, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2026.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10B 41/27 (2023.02); H10B 43/27 (2023.02);
Abstract

A semiconductor device may include a first substrate structure including a substrate, circuit elements on the substrate, and first bonding layers on the circuit elements, and a second substrate structure on the first substrate structure. The second substrate structure may include a plate layer, an intermediate insulating layer below the plate layer and including silicon nitride, gate electrodes below the intermediate insulating layer and stacked to be spaced apart from each other in a vertical direction, a channel structure in a channel hole passing through the intermediate insulating layer and the gate electrodes and including a semiconductor layer, and second bonding layers connected to the first bonding layers. The channel hole may have a first width in a first portion passing through the gate electrodes and a second width, wider than the first width, in a second portion passing through the intermediate insulating layer.


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