The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Nov. 30, 2022
Intel Corporation, Santa Clara, CA (US);
Jia Yan Go, Kulim, MY;
Tin Poay Chuah, Bayan Baru, MY;
Juha Paavola, Hillsboro, OR (US);
Twan Sing Loo, Butterworth, MY;
Sami Heinisuo, Dallas, OR (US);
Kari Mansukoski, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods, apparatus, systems, and articles of manufacture to increase rigidity of printed circuit boards are disclosed. An apparatus includes a stack of insulative layers. The stack includes a first face and a second face opposite the first face. The apparatus further includes a plurality of conductive layers. Ones of the conductive layers between adjacent ones of the insulative layers. The apparatus also includes a metal stiffener extending along a perimeter of a first one of the insulative layers. The metal stiffener has a thickness measured in a direction perpendicular to the first face. The thickness is less than a distance between the first and second faces.