The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Jul. 06, 2024
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xiaokang Yang, Fremont, CA (US);

Tza-Jing Gung, San Jose, CA (US);

John C. Forster, Mountain View, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 7/06 (2006.01); H01P 1/208 (2006.01); H01P 1/213 (2006.01); H01P 7/04 (2006.01);
U.S. Cl.
CPC ...
H01P 1/2084 (2013.01); H01P 1/2086 (2013.01); H01P 1/2088 (2013.01); H01P 1/2138 (2013.01); H01P 7/04 (2013.01); H01P 7/06 (2013.01);
Abstract

Embodiments described herein relate to an apparatus that includes a dielectric puck with a height between a first surface and a second surface. In an embodiment, the apparatus further includes a pin that is inserted into a hole into the first surface of the dielectric puck, where the pin is electrically conductive. In an embodiment, the pin includes a first portion with a first width, and a second portion with a second width. In an embodiment, the second width is greater than the first width.


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