Interface layout for stacked memory architectures

Abstract

Methods, systems, and devices for an interface layout for stacked memory architectures are described. A memory interface block may interface a plurality of memory dies to a host controller. The memory interface block may include an interface block coupled with multiple memory dies, which may be stacked on the memory interface block using through-silicon-vias. The memory interface block may include controllers, datapath blocks, and interface blocks associated with each memory die. As such, the memory interface block may perform functions such as queueing, ECC, and performing row repair and column repair procedures. In some examples, a layout for the memory interface block may include pairing controllers for at least two memory devices, such that a pair of controllers may share a command port to a pair of memory dies. Further, the memory interface block may include interfaces to the host controller that are different from the interface to each memory die.