The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Apr. 27, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/029 (2006.01); G03F 7/033 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0295 (2013.01); G03F 7/033 (2013.01); G03F 7/2006 (2013.01);
Abstract
An aspect of the present disclosure relates to a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, in which the binder polymer includes a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group, and a weight molecular weight of the binder polymer is 7500 to 23000.
Kato, Tetsuya. (2026). Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board (U.S. Patent No. 12717233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12717233
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile