The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Aug. 24, 2023
Tokyo Electron Limited, Tokyo, JP;
Derek Bassett, Austin, TX (US);
Rencheng Dong, Austin, TX (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of flow control is provided. The method includes injecting a liquid onto a wafer via a dispense system. The dispense system includes a plate and an injection hole in the plate. The plate is positioned away from the wafer at a distance and has a diameter equal to or larger than the wafer. A drying gas is injected onto the wafer via the dispense system to push out the liquid. While injecting the drying gas onto the wafer via the dispense system, at least one parameter selected from the group consisting of an inlet flow pressure of the injection hole, the distance and an injection sequence is adjusted so that an interface between the drying gas and the liquid is stable.