The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2026

Filed:

Oct. 21, 2022
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Hyeon Gyu Lee, Incheon, KR;

Byong Jin Kim, Seoul, KR;

Kyoung Yeon Lee, Incheon, KR;

Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10W 76/47 ; H10W 74/131 ; H10W 74/111 ; H10W 74/114 ; H10W 76/15 ; H10W 70/68 ; H10W 74/01 ; H10W 74/016 ; H10W 74/124 ; H10W 72/071 ; B01L 3/502707 ; B01L 2300/0645 ; B01L 2300/0816 ;

Find Patent Forward Citations

Lee, Hyeon Gyu. (2026). Semiconductor devices and methods of manufacturing semiconductor devices (U.S. Patent No. 12713969). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713969

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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