The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
Jan. 20, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Jhon Jhy Liaw, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., HSINCHU, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10D 84/0188 ; H10W 20/427 ; H10D 30/014 ; H10D 84/0186 ; H10D 84/85 ; H10D 62/121 ; H10D 64/017 ; H10D 30/501 ; H10D 84/0167 ; H10D 62/151 ; H10D 30/797 ; H10D 30/6735 ; H10D 30/0195 ; H10D 84/017 ; H10D 30/43 ; H10D 84/038 ; H10D 30/6729 ; H10D 84/83 ; H10D 84/8312 ; H10D 84/0149 ; H10D 30/507 ; H10D 84/851 ; H10D 30/0198 ; H10W 20/40 ; H10W 20/069 ; H10D 64/0112 ;
Liaw, Jhon Jhy. (2026). Semiconductor structure having back-side contact and manufacturing method thereof (U.S. Patent No. 12713897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713897
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile