The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2026

Filed:

Aug. 08, 2024
Applicant:

Kla Corporation, Milpitas, CA (US);

Inventor:

Xuewen Wang, Milpitas, CA (US);

Assignee:

KLA CORPORATION, MILPITAS, CA (US);

Int. Cl.
CPC ...
U.S. Cl.
CPC ...
G01N 21/9501 ; H10P 74/203 ; H10P 74/23 ; H10P 72/0611 ; H10P 72/0616 ; G01B 9/02034 ;

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Wang, Xuewen. (2026). System and method for wafer shape pairing for improved post-bonding performance (U.S. Patent No. 12710378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12710378

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