The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jan. 18, 2023
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Ying-Chung Chen, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 72/30 (2026.01); H10W 72/59 (2026.01); H10W 72/90 (2026.01); H10W 74/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/465 (2026.01); H10W 72/015 (2026.01); H10W 72/50 (2026.01); H10W 74/01 (2026.01); H10W 74/141 (2026.01); H10W 90/00 (2026.01); H10W 72/07552 (2026.01); H10W 72/07554 (2026.01); H10W 72/342 (2026.01); H10W 72/527 (2026.01); H10W 72/547 (2026.01); H10W 72/59 (2026.01); H10W 72/9415 (2026.01); H10W 74/00 (2026.01); H10W 90/732 (2026.01); H10W 90/755 (2026.01);
Abstract
At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.