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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12707983 B1

PDFFull Text
Date of Patent:
Aug. 11, 2026

Filed:

Apr. 24, 2023

Semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Akira Hirao, Matsumoto, JP;

Yoshinari Ikeda, Matsumoto, JP;

Motohito Hori, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:

Lawrence C Tynes, Jr

Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H05K 1/18 (2006.01); H05K 1/183 (2026.01);
U.S. Cl.
CPC ...
H01L 23/647 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H05K 1/183 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1033 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract

A semiconductor device includes: an insulated circuit substrate; a semiconductor chip provided on the insulated circuit substrate; a first external connection terminal provided on the insulated circuit substrate; a relay terminal provided on the insulated circuit substrate; a printed circuit board arranged over the semiconductor chip and connected to the first external connection terminal and the relay terminal; and a first snubber circuit provided on the printed circuit board and having one end connected to the first external connection terminal via the printed circuit board and another end connected to the relay terminal via the printed circuit board.

Find Patent Forward Citations

Hirao, Akira. (2026). Semiconductor device (U.S. Patent No. 12707983). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12707983

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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