The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Mar. 24, 2022
Applicants:

Tencent Technology (Shenzhen) Company Limited, Shenzhen, CN;

Suzhou Institute of Nano-tech & Nano-bionics (Sinano), Chinese Academy of Sciences, Suzhou, CN;

Inventors:

Wenlong Zhang, Shenzhen, CN;

Chuhong Yang, Shenzhen, CN;

Sainan Huai, Shenzhen, CN;

Yarui Zheng, Shenzhen, CN;

Shengyu Zhang, Shenzhen, CN;

Jiagui Feng, Shenzhen, CN;

Kanglin Xiong, Shenzhen, CN;

Biao Wu, Shenzhen, CN;

Yongdan Huang, Shenzhen, CN;

Xiao Chen, Shenzhen, CN;

Sunan Ding, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/40 (2026.01); H10W 20/00 (2026.01); H10W 20/46 (2026.01); H10W 70/65 (2026.01);
U.S. Cl.
CPC ...
H10W 20/483 (2026.01); H10W 20/072 (2026.01); H10W 20/075 (2026.01); H10W 20/46 (2026.01); H10W 70/65 (2026.01);
Abstract

A manufacturing method for an air bridge structure includes forming a first photoresist structure on a substrate. The first photoresist structure includes a first opening that reveals the substrate. The manufacturing method further includes forming a bridge supporting structure on the substrate by depositing an inorganic bridge supporting material on the substrate based on the first opening in the first photoresist structure, and stripping the first photoresist structure after the deposition. Then, the manufacturing method includes forming a second photoresist structure on the substrate. The second photoresist structure includes at least a second opening that reveals at least a portion of the bridge supporting structure on the substrate. Then, the method include forming the air bridge structure by depositing an air bridge material on the substrate based on the second opening and stripping the second photoresist structure after the deposition. Further, the bridge supporting structure can be removed.


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