The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Oct. 05, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Cheng Liu, Hsinchu, TW;

Wei-Zhong Chen, Taipei City, TW;

Chi-Ming Yang, Hsinchu City, TW;

Jr-Hung Li, Hsinchu County, TW;

Yung-Cheng Lu, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/505 (2006.01); C23C 16/26 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01); H10P 50/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/73 (2026.01); C23C 16/26 (2013.01); C23C 16/505 (2013.01); C23C 16/56 (2013.01); H01J 37/32174 (2013.01); H01J 37/32449 (2013.01); H10P 50/691 (2026.01); H01J 2237/3321 (2013.01);
Abstract

A method includes following steps. A target layer is formed over a substrate. A first hard mask layer is formed over the target layer by a plasma generated using a first radio frequency generator and a second radio frequency generator. The first radio frequency generator and the second radio frequency generator have different powers. A second hard mask layer is formed over the first hard mask layer by a plasma generated using the first radio frequency generator without using the second radio frequency generator. A photoresist layer is formed over the second hard mask layer. The photoresist layer is exposed. The photoresist layer is developed. The first hard mask layer and the second hard mask layer are patterned using the photoresist layer as an etch mask. The target layer is patterned using the first hard mask layer and the second hard mask layer as an etch mask.


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