The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Jan. 26, 2024
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Hsin-Lun Su, Hsinchu, TW;

Jo-Hsiang Chen, Hsinchu, TW;

Chun-Min Lin, Hsinchu, TW;

Assignee:

Ennostar Corporation, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.


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