The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Jul. 25, 2022
Micron Technology, Inc., Boise, ID (US);
Synn Nee Chow, Singapore, SG;
Robert Brian Skaggs, Kuna, ID (US);
Chao Lin Lee, Singapore, SG;
Alex James Schrinsky, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods, systems, and apparatuses for erosion rate monitoring for wafer fabrication equipment are described to support determining a real-time edge ring erosion rate for an edge ring used in manufacturing memory devices or other semiconductor devices. A manufacturing system may support a real-time edge ring erosion rate determination using force sensors, which may measure the weight of the edge ring. The controller may correlate the measured weight to a height of the edge ring. The controller may use the height to adjust a vertical placement of the edge ring, or one or more other manufacturing variables, during manufacturing operations, which may compensate for edge ring erosion and reduce or eliminate yield loss when manufacturing a memory device or other semiconductor device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile