The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Aug. 26, 2024
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Ying Huang, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0613 (2013.01); G06F 3/0659 (2013.01); G06F 3/0679 (2013.01);
Abstract

A processing device includes flash translation layer logic to be coupled to a memory device and that includes cursor logic to generate a criteria set associated with generating a backend command to be sent the memory device and streamer logic to access and employ the criteria set, e.g., aggregates translation units (TUs) received in one or more write messages. The criteria set enables accessing the plurality of TUs within a first format, of the one or more write messages, that depends on a data path associated with the one or more write messages. The streamer logic formats the aggregated TUs into the backend command having a second format for transmittal to the memory device. The backend command is to direct the memory device in writing TU data, associated with the TUs, to a memory array of the memory device.


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Huang, Ying. (2026). Flash translation layer write path architecture for increased throughput (U.S. Patent No. 12704964). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12704964

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