The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Sep. 26, 2023
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Horia Alexandru Toma, Sunnyvale, CA (US);

Zuowei Shen, Los Altos, CA (US);

Ilyas Mohammed, San Jose, CA (US);

Yingying Wang, Sunnyvale, CA (US);

William F. Edwards, Jr., Livermore, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01); H10B 80/00 (2023.01);
U.S. Cl.
CPC ...
G02B 6/4268 (2013.01); G02B 6/4204 (2013.01); G02B 6/4249 (2013.01); H10B 80/00 (2023.02);
Abstract

The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.


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