The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Feb. 24, 2022
Adeka Corporation, Tokyo, JP;
Atsushi Sakurai, Tokyo, JP;
Yoshiki Ooe, Tokyo, JP;
Keisuke Takeda, Tokyo, JP;
Chiaki Mitsui, Tokyo, JP;
Atsushi Yamashita, Tokyo, JP;
ADEKA CORPORATION, Tokyo, JP;
Abstract
Provided is a thin-film forming raw material, which is used in an atomic layer deposition method, including a compound represented by the following general formula (1):()()()] (1)in the formula (1), R, R, and Reach independently represent a linear or branched alkyl group having 1 to 4 carbon atoms, Arepresents a linear or branched alkylene group having 1 to 5 carbon atoms, x1 represents an integer of from 0 to 2, y1 represents an integer of from 1 to 3, and M represents an indium atom or a zinc atom, provided that when M represents an indium atom, a compound in which x1 represents 2, y1 represents 1, and R, R, and Reach represent a methyl group is excluded.