The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Jul. 28, 2023
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chiung-Ying Kuo, Kaohsiung, TW;

Chun-Yen Ting, Kaohsiung, TW;

Hung-Chun Kuo, Kaohsiung, TW;

Jung Jui Kang, Kaohsiung, TW;

Chang Chi Lee, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/685 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/685 (2026.01); H10W 70/65 (2026.01); H10W 90/794 (2026.01);
Abstract

An electronic device is disclosed. The electronic device includes an electronic component, an input/output (I/O) signal delivery circuit, and a power delivery circuit. The electronic component has a first surface and a second surface opposite to the first surface. The I/O signal delivery circuit is disposed under the first surface of the electronic component. The power delivery circuit is disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device.


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