The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Mar. 23, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a base film, a first conductive structure disposed on a first surface of the base film, a second conductive structure disposed on a second surface of the base film, a via passing through the base film and connecting the first conductive structure to the second conductive structure, a semiconductor chip on the first surface and electrically connected to the first conductive structure, a first insulating layer covering the first conductive structure and including a first opening exposing a first conductive pattern of the first conductive structure, a first conductive layer disposed on the first insulating layer, covering the first insulating layer and the semiconductor chip, and contacting a region of the first conductive pattern exposed by the first opening, and a second conductive layer disposed on the second surface, covering the second conductive structure, and contacting at least a portion of the second conductive structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile