The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Sep. 14, 2022
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Se Woong Na, Seoul, KR;

Sang Il Kim, Seoul, KR;

Kee Han Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/60 (2026.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/181 (2026.01); H10W 70/685 (2026.01);
U.S. Cl.
CPC ...
H10W 70/611 (2026.01); H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H10W 70/685 (2026.01); H05K 2201/0939 (2013.01); H05K 2201/09509 (2013.01);
Abstract

A circuit board including a first insulating layer; a first circuit pattern layer disposed on the first insulating layer and including a first pad; a second circuit pattern layer disposed on a lower surface of the first insulating layer; and a first electrode part disposed in the first insulating layer and vertically overlapping the first pad. A lower surface of the first electrode part is located higher than an upper surface of the second circuit pattern layer, and the first pad includes a first concave portion formed in a region that vertically overlaps the first electrode part.


Find Patent Forward Citations

Na, Se. (2026). Circuit board (U.S. Patent No. 12702024). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12702024

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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