The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Nov. 07, 2022
Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;
Keisuke Maeda, Tokyo, JP;
Norito Morishita, Tokyo, JP;
Tetsuro Itagaki, Tokyo, JP;
Yoshiki Yoshioka, Tokyo, JP;
SUMITOMO OSAKA CEMENT CO., LTD., Tokyo, JP;
Abstract
An electrostatic chuck device including: an electrostatic chuck plate including a dielectric substrate that includes a placement surface on which a sample is mounted and an adsorption electrode that is positioned inside the dielectric substrate; and a base that supports the electrostatic chuck plate. The electrostatic chuck plate includes a first through-hole through which gas is supplied to the placement surface, a porous body that allows passage of the gas is inserted into the first through-hole, a first adhesive layer that bonds an inner peripheral surface of the first through-hole and an outer peripheral surface of the porous body to each other, and a thickness dimension of the first adhesive layer is 0 mm or more and 0.15 mm or less, at least in a region of 0.1 mm from the placement surface.