The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Feb. 09, 2023
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Chen-Dong Tzou, Taipei City, TW;

Yun-Kai Lai, Taichung City, TW;

Chih-Cherng Liao, Zhudong Township, TW;

Chia-Hao Lee, Zhubei City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 8/60 (2025.01); H10D 8/01 (2025.01);
U.S. Cl.
CPC ...
H10D 8/60 (2025.01); H10D 8/051 (2025.01);
Abstract

A semiconductor structure is provided. The semiconductor structure includes a substrate, an epitaxial layer, a well region, an insulating structure, an upper electrode layer, and a lower electrode layer. The substrate has the first conductivity type. The epitaxial layer is disposed on the substrate and has the first conductivity type. There is a protruding structure on the upper portion of the epitaxial layer. The well region is disposed in the epitaxial layer. The well region has the second conductivity type. The insulating structure is disposed on the sidewall of the protruding structure. The upper electrode layer surrounds the protruding structure and is electrically connected to the epitaxial layer and the well region. The lower electrode layer is disposed under the substrate and opposite to the epitaxial layer.


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