The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Mar. 09, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Dinkesh Huderi Somanna, San Jose, CA (US);

Ala Moradian, San Jose, CA (US);

Colin John Dickinson, San Jose, CA (US);

Manjunath Subbanna, Bengaluru, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 14/34 (2006.01); H01J 37/32 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32477 (2013.01); C23C 14/34 (2013.01); H01J 2237/332 (2013.01);
Abstract

Embodiments of heat shield assemblies for a processing chamber are provided herein. In some embodiments, a heat shield assembly for a processing chamber includes: a first shield comprising a circular plate; a second shield coupled to the first shield and in a parallel configuration with the first shield, wherein the second shield has an outer diameter greater than an outer diameter of the first shield and the second shield includes a central opening having a diameter smaller than an outer diameter of the first shield; and a third shield coupled to and in a parallel configuration with the second shield, wherein an outer diameter of the third shield is greater than the diameter of the central opening of the second shield.


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