The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Mar. 30, 2023
Toyobo MC Corporation, Osaka, JP;
Fumika Kawano, Otsu, JP;
Teruyuki Taninaka, Otsu, JP;
Daisuke Sakura, Otsu, JP;
Shinichi Kobuchi, Osaka, JP;
TOYOBO MC CORPORATION, Osaka, JP;
Abstract
It is provided that: a three-dimensional network structure that exhibits excellent cushioning property and excellent compression recoverability after thermal compression at a usage environmental temperature; and a manufacturing method therefor. A three-dimensional network structure having a three-dimensional random loop-bonded configuration and comprising a continuous filament made from a thermoplastic resin composition, wherein the thermoplastic resin composition contains 70% by mass or higher of a polybutylene adipate terephthalate resin, and an enthalpy of an endothermic peak in which a DSC curve regarding the continuous filament measured by using a differential scanning calorimeter has a minimum value in a range from 30° C. to 70° C. of 2.5 J/g or lower.