The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Jun. 23, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Alois Nitsch, Munich, DE;

Han-Wen Lin, Zhubei City, TW;

Yin-Ying Chen, Hsinchu City, TW;

Meng-Chi Lee, Taipei, TW;

Andreas Dost, Freising, DE;

Hans Gerard Jetten, Anzing, DE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10P 72/70 (2026.01); H10W 70/05 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 70/652 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10P 72/74 (2026.01); H10W 70/05 (2026.01); H10W 70/09 (2026.01); H10W 70/093 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/016 (2026.01); H10W 74/019 (2026.01); H10P 72/7436 (2026.01); H10W 70/6528 (2026.01); H10W 90/20 (2026.01); H10W 90/291 (2026.01);
Abstract

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface; a redistribution layer (RDL) having a surface, wherein the first surface of the first die is on and electrically coupled to the surface of the RDL by non-solder interconnects; and a second die at the second surface of the first die, wherein the second die is electrically coupled directly to the second surface of the first die by solder interconnects.


Find Patent Forward Citations

Nitsch, Alois. (2026). Microelectronic assemblies including solder and non-solder interconnects (U.S. Patent No. 12696800). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12696800

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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