The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Sep. 02, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Yoichi Hironaka, Tokyo, JP;
Tatsunori Yanagimoto, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
The present disclosure has been conceived to solve such a problem, and it is an object of the present disclosure to provide a semiconductor device enabling reduction in cost. A semiconductor device according to the present disclosure includes: a base plate; an insulating substrate disposed over the base plate; a semiconductor chip disposed over the insulating substrate; a first resin case and a second resin case attached to the base plate to enclose the insulating substrate and the semiconductor chip, and fitted together; and a sealing material to seal the insulating substrate and the semiconductor chip, wherein the first resin case and the second resin case are formed of resin materials having different comparative tracking indices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile