The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Aug. 31, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes: a redistribution structure including a plurality of redistribution insulation layers, which are stacked, a plurality of redistribution line patterns on an upper surface and a lower surface of the plurality of redistribution insulation layers, and constituting a plurality of distribution layers at different vertical levels from each other, and a plurality of redistribution vias that penetrate at least one redistribution insulation layer of the plurality of redistribution insulation layers and are connected to some of the plurality of redistribution line patterns; and at least one semiconductor chip on the redistribution structure and electrically connected to the plurality of redistribution line patterns and the plurality of redistribution vias.