The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Aug. 10, 2021
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Shaun Bowers, Gilbert, AZ (US);
Yoshio Matsuda, Chandler, AZ (US);
Hyung Il Jeon, Gyeonggi-do, KR;
Byong Jin Kim, Seoul, KR;
Gi Jeong Kim, Gyeonggi-do, KR;
Jae Min Bae, Seoul, KR;
Seung Woo Lee, Incheon, KR;
Yong Ho Son, Incheon, KR;
Miki Nakashima, Kanagawa, JP;
Kazuaki Nagasawa, Kanagawa, JP;
Shingo Nakamura, Kanagawa, JP;
Sophie Olson, Chandler, AZ (US);
Jin Young Khim, Seoul, KR;
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Abstract
In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.