The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jan. 27, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Wen-Hao Cheng, Hsinchu, TW;
Yen-Yu Chen, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01); B25J 11/00 (2006.01); B25J 13/08 (2006.01); H10P 72/50 (2026.01); H10P 72/72 (2026.01); H10P 72/78 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7602 (2026.01); B25J 11/0095 (2013.01); B25J 13/089 (2013.01); H10P 72/50 (2026.01); H10P 72/722 (2026.01); H10P 72/78 (2026.01);
Abstract
A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.