The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
May. 22, 2024
Winbond Electronics Corp., Taichung City, TW;
Kai Jen, Taichung City, TW;
Hsiang-PO Liu, Taichung City, TW;
WINBOND ELECTRONICS CORP., Taichung City, TW;
Abstract
A semiconductor structure includes a substrate, an insulating layer formed on the substrate, and a plurality of pairs of linear structures arranged in parallel and formed in the insulating layer, wherein each pair of linear structures has a first linear structure and a second linear structure. There is a first space Sbetween an end portion of the first linear structure and an end portion of the second linear structure, there is a second space Sbetween a center portion of the first linear structure and a center portion of the second linear structure, and the second space Sis greater than the first space S