The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Mar. 08, 2023
Winbond Electronics Corp., Taichung City, TW;
Tzu-Hsun Huang, Chiayi City, TW;
Yi-Hao Chien, Taichung City, TW;
Winbond Electronics Corp., Taichung City, TW;
Abstract
A semiconductor structure includes a substrate, several buried word lines in the substrate, a dielectric material layer on the substrate, a semiconductor material layer on the dielectric material layer, and several contacts disposed on the substrate. The substrate includes several active regions and isolation structures that surround the active regions. The contacts are adjacent to the semiconductor material layer, and penetrate the semiconductor material layer, the dielectric material layer and parts of the substrate. The contacts are positioned in the respective active regions.