The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Sep. 17, 2021
Applicant:

Ireach Corporation, Hsinchu, TW;

Inventors:

Shou-Lung Chen, Hsinchu, TW;

Hsin-Chan Chung, Hsinchu, TW;

Hsiu-Ju Yang, Hsinchu, TW;

Chih-Chiang Lu, Hsinchu, TW;

Kuo-Min Huang, Hsinchu, TW;

Assignee:

IREACH CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/183 (2006.01); H01S 5/02 (2006.01); H01S 5/0233 (2021.01);
U.S. Cl.
CPC ...
H01S 5/183 (2013.01); H01S 5/0206 (2013.01); H01S 5/0233 (2021.01);
Abstract

A package structure of a laser device is provided, including: a first light transmissive substrate including a first surface, a second surface opposing the first surface, a first side surface between the first surface and the second surface, and a second side surface opposing the first side surface; a laser structure including a first laser chip and a second laser chip which are disposed on the first surface, and the first laser chip including a third side surface; a first optical component disposing on the first light transmissive substrate and corresponding in position to the first laser chip; and a second optical component disposing on the light transmissive substrate and corresponding in position to the second laser chip; wherein the first side surface is coplanar with the third side surface.


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