The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Feb. 16, 2021
Siemens Industry Software Inc., Plano, TX (US);
Max Clark, Dove Canyon, CA (US);
Alex Zigelboim, Yavne, IL;
Keren Paryenti, Yavne, IL;
Tal Zur, Rishon-Lezlon, IL;
Siemens Industry Software Inc., Plano, TX (US);
Abstract
A PCB analysis utilizes manufacturing capability data shared in a multi-tenant collaborative network in a mixed cloud and on-premise environment. Access to a tenant's account of a DFM application deployed on the tenant's premises is provided. The DFM application is enabled to activate the PCB analysis on a DFM profile with manufacturing capability data. The tenant's account requests a utilization authorization of a given DFM profile stored in a cloud data layer. When the utilization is authorized, the given DFM profile is downloaded embedded in a locked DFM envelope, which locks together the given DFM profile with an injected identifier of the authorized tenant's account. Via the DFM application, when logged into the tenant's account, the PCB analysis is activated by permitting the unlocking of the DFM profile from the DFM envelope only when the identifier of the tenant's account is the same as the injected identifier.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile