The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jan. 16, 2024
Applicant:

Globalwafers Co., Ltd., Hsinchu City, TW;

Inventors:

Chih-Yuan Chuang, Hsinchu City, TW;

Jui-Pin Chen, Hsinchu City, TW;

Jia-Zhe Liu, Hsinchu City, TW;

Assignee:

GLOBALWAFERS CO., LTD., Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7611 (2026.01);
Abstract

A wafer carrier with a bottom for connecting to a shaft includes a disc body and at least one heat insulator. The disc body has an accommodating groove for accommodating a wafer, and the disc body has a first surface and a second surface opposing each other. A groove bottom of the accommodating groove has the first surface. The at least one heat insulator is disposed on either the first surface or the second surface. When the wafer is accommodated in the accommodating groove, the at least one heat insulator is positioned between the wafer and the shaft.


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