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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12690172 B1

PDFFull Text
Date of Patent:
Jul. 21, 2026

Filed:

Oct. 30, 2023

Data throughput using a metal bracket

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Deepu Narasimiah Subhash, Yeshwanthpu, IN;

Suresh Reddy Yarragunta, Bangalore, IN;

Koneri Sathyanarayana Guptha Amith, Banaswadi, IN;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Paul D Lee

Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01); G06F 1/185 (2026.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); G06F 1/206 (2013.01); H05K 1/0215 (2013.01); H05K 7/20509 (2013.01); G06F 1/185 (2013.01); G06F 1/20 (2013.01); H05K 1/18 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/10159 (2013.01);
Abstract

Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.

Find Patent Forward Citations

Subhash, Deepu. (2026). Data throughput using a metal bracket (U.S. Patent No. 12690172). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690172

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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