The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Sep. 02, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Juha T. Paavola, Hillsboro, OR (US);
Kari Pekka Johannes Mansukoski, Hillsboro, OR (US);
Sami M. Heinisuo, Dallas, OR (US);
Cody K. Hougnon, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A top side frame stiffener structure for a printed circuit board (PCB) stack. The structure is placed between a cooling component and a backing plate, in an area surrounding a substrate package. The structure does not cause the overall height of the PCB stack to increase.