The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Aug. 27, 2021
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Yu-Hsiang Chao, Taipei City, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu, TW;
Abstract
An apparatus for polishing a wafer is provided. The apparatus includes a wafer carrier assembly including a head body and a retainer arrangement. The retainer arrangement includes a first retainer segment coupled to an underside of the head body and adjacent an outer sidewall of the wafer carrier and a second retainer segment, separate from the first retainer segment, coupled to the underside of the head body and adjacent the outer sidewall of the wafer carrier. Undersides of the first retainer segment and the second retainer segment are below an underside of the wafer carrier.