The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jul. 22, 2025
Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Hui Xu, Chalfont, PA (US);

Jesse Parish, North Wales, PA (US);

Gary S. Gillotti, North Wales, PA (US);

Kam-Shing Wong, Lansdale, PA (US);

Basil Milton, Furlong, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/26 (2006.01); B23K 37/04 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 20/005 (2013.01); B23K 20/26 (2013.01); B23K 37/0426 (2013.01); B23K 2101/40 (2018.08);
Abstract

A wire bonding system is provided. The wire bonding system includes a bond head assembly configured to carry a wire bonding tool. The wire bonding system also includes a support structure configured to support a workpiece. The workpiece is configured for wire bonding. The wire bonding system also includes a movable stage assembly including a movable stage configured to move with respect to the wire bonding tool. The wire bonding tool is configured to press a wire engaged with the wire bonding tool against the movable stage to create a deformed portion of the wire.


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