The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Dec. 20, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Tomoko Higashiuchi, Tokyo, JP;
Hiroshi Yokota, Tokyo, JP;
Tomohiko Kotake, Tokyo, JP;
Naoki Furukawa, Tokyo, JP;
Naoki Maruyama, Tokyo, JP;
Yutaka Okada, Tokyo, JP;
Nozomi Matsubara, Tokyo, JP;
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/01 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/017 (2026.01); H10W 72/07236 (2026.01); H10W 72/07336 (2026.01);
Abstract
A method for manufacturing a semiconductor device, the method including: a step of disposing an adhesive thermal insulation material on a semiconductor device; a step of performing reflow of the semiconductor device having the thermal insulation material disposed thereon; and a step of detaching the thermal insulation material from the semiconductor device.