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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12685185 B1

PDFFull Text
Date of Patent:
Jul. 14, 2026

Filed:

Jun. 28, 2023

Semiconductor device with leadframe spacer and method therefor

Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Yao Jung Chang, Kaohsiung, TW;

Tzu Ya Fang, Tainan City, TW;

Yu Ling Tsai, Kaohsiung City, TW;

Jian Nian Chen, Kosiiung City, TW;

Yen-Chih Lin, Hsinchu City, TW;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:

Dale E Page

Assistant Examiner:

Rohit undefined Parthasarathy

Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 42/00 (2026.01); H10W 70/04 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/424 (2026.01); H10W 42/121 (2026.01); H10W 70/047 (2026.01); H10W 74/01 (2026.01); H10W 74/111 (2026.01); H10W 72/884 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract

A method of manufacturing a semiconductor device is provided. The method includes affixing a spacer structure to a bottom side of a plurality of leads of a leadframe. A semiconductor die is attached to a top side of a die pad of the leadframe. The semiconductor die, the leadframe, and the spacer structure are encapsulated with an encapsulant. Portions of the spacer structure and portions of the leads of the plurality of leads are exposed at a bottom side of the encapsulant.

Find Patent Forward Citations

Chang, Yao. (2026). Semiconductor device with leadframe spacer and method therefor (U.S. Patent No. 12685185). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12685185

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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