The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Sep. 12, 2023
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Joon Dong Kim, Incheon, KR;

Gi Tae Lim, Seoul, KR;

Gi Jeong Kim, Gyeonggi-do, KR;

Min Hwa Chang, Incheon, KR;

Gyu Wan Han, Incheon, KR;

Hwi Won Yun, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 70/02 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 72/20 (2026.01); H10W 72/50 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 70/02 (2026.01); H10W 72/884 (2026.01); H10W 74/014 (2026.01); H10W 74/016 (2026.01); H10W 74/117 (2026.01); H10W 72/07554 (2026.01); H10W 72/252 (2026.01); H10W 72/552 (2026.01); H10W 72/5522 (2026.01); H10W 72/5524 (2026.01); H10W 72/5525 (2026.01); H10W 72/555 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 90/754 (2026.01);
Abstract

In one example, an electronic device includes a substrate, an electronic component disposed over the substrate, and an encapsulant disposed over the substrate and the electronic component. A molded heat spreader can be disposed over the encapsulant and can comprise a heat spreader and a mold compound disposed around a lateral side of the heat spreader. A lateral side of the mold compound is coplanar with a lateral side of the encapsulant. Other examples and related methods are also disclosed herein.


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