The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
May. 26, 2023
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Yuki Inoue, Tokyo, JP;
Naoko Yamamoto, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
H10P 72/0428 (2026.01); B24B 7/228 (2013.01); H10P 72/0414 (2026.01);
Abstract
A wafer processing method includes an outer edge removing step of removing an outer edge of a first wafer having a first wiring layer formed on a front surface thereof from the front surface, and a polishing step of polishing the first wiring layer on the front surface of the first wafer after the outer edge removing step.