The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Aug. 08, 2022
Applicant:

Ebara Corporation, Tokyo, JP;

Inventor:

Mitsutoshi Yahagi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); H10P 14/46 (2026.01); H10P 52/00 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0414 (2026.01); H10P 72/0476 (2026.01); H10P 72/7618 (2026.01); C25D 7/12 (2013.01); C25D 17/00 (2013.01); H10P 52/00 (2026.01); H10P 72/0416 (2026.01); H10P 72/0448 (2026.01); H10P 72/0462 (2026.01);
Abstract

To achieve a small-sized pre-wet module that can perform different pre-processes. A pre-wet moduleincludes a stage, a rotation mechanism, a cleaning liquid supply member, and a deaerated liquid supply member. The stageis configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanismis configured to rotate the stage. The cleaning liquid supply memberhas a nozzlearranged above the stage. The cleaning liquid supply memberis configured to supply a cleaning liquid in a direction to the stagevia the nozzle. The deaerated liquid supply memberis configured to supply a deaerated liquid to a surface to be processed WF-a of a substrate WF held onto the stage. The deaerated liquid supply memberis configured to be movable between a supply position and a retracted position. The supply position is located between the nozzleand the surface to be processed WF-a of the substrate WF, and the retracted position is retracted from between the nozzleand the surface to be processed WF-a of the substrate WF.


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