The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Mar. 30, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Roman Chepulskyy, Santa Clara, CA (US);
Dmytro Apalkov, San Jose, CA (US);
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 50/80 (2023.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01); H10N 50/10 (2023.01); H10N 50/85 (2023.01); H10N 59/00 (2026.01);
U.S. Cl.
CPC ...
H10N 50/80 (2023.02); H10B 61/00 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02); H10N 50/85 (2023.02); H10N 59/00 (2023.02);
Abstract
A magnetic junction includes a free layer including iron (Fe), the free layer has a first planar surface and a first side surface crossing the first planar surface; a first cap layer on the first planar surface of the free layer; and a protection layer on the first cap layer, wherein the protection layer is 8 angstroms (Å) or less in thickness. The protection layer may include one or more elements selected from the group consisting of Ta, Rh, Nb, C, Os, Ir, W, Re, Si, Ru, Ti, and Pt.