The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Mar. 01, 2023
International Business Machines Corporation, Armonk, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Brent A. Anderson, Jericho, VT (US);
Albert M. Chu, Nashua, NH (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Reinaldo Vega, Mahopac, NY (US);
David Wolpert, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure includes a first plurality of backside power rail interconnects located within a first cell height region of a substrate. A second plurality of backside power rail interconnects are located within a second cell height region of the substrate. A first isolation region is located between the first cell height region of the substrate and the second cell height region of the substrate. The first isolation region electrically separates the first cell height region and the second cell height region. A second isolation region is located between adjacent power rail interconnects of the first plurality of backside power rail interconnects and between adjacent power rail interconnects of the second plurality of backside power rail interconnects. The second isolation region electrically separates the adjacent power rail interconnects.