The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
May. 19, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H03F 1/56 (2006.01); H03F 3/24 (2006.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01);
U.S. Cl.
CPC ...
H03F 3/245 (2013.01); H03F 1/565 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H10W 90/00 (2026.01); H10W 90/297 (2026.01);
Abstract
An integrated circuit includes a first substrate having a first substrate material, and the first substrate includes a first circuit. A second substrate has a second substrate material different than the first substrate material, and the second substrate includes a second circuit. A conductive interconnect electrically connects the first circuit and the second circuit.