The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Dec. 06, 2023
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventor:

Chia-Yen Lee, New Taipei City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/631 (2006.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/714 (2013.01); H01R 13/631 (2013.01); H10W 72/00 (2026.01);
Abstract

A connecting system and an electrical connector for a chip module are provided. The connecting system includes the chip module and the electrical connector. The chip module includes a chip substrate. The chip substrate has a plurality of first conductive pads arranged in a matrix manner. The electrical connector includes a first output end and a second output end. The first output end is configured to connect with a plurality of external cables, and the second output end has a plurality of conductive contact parts arranged in the matrix manner. The second output end of the electrical connector is disposed face-to-face with the chip module. The conductive contact parts are electrically connected to the first conductive pads of the chip substrate.


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