The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Mar. 16, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jian Li, Fremont, CA (US);

Juan Carlos Rocha-Alvarez, San Carlos, CA (US);

Vijay D. Parkhe, San Jose, CA (US);

Wenhao Zhang, San Jose, CA (US);

Mayur Govind Kulkarni, Bangalore, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/50 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); C23C 16/45565 (2013.01); C23C 16/4586 (2013.01); C23C 16/463 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/3321 (2013.01);
Abstract

A substrate support assembly includes a shaft with a platen extending perpendicularly from the shaft at an upper end of the shaft. The shaft includes an electric line and a plurality of coolant conduits. A cooling plate including a coolant channel fluidically coupled to the coolant conduits is mounted to the platen, and extends beyond an outer rim of the platen. A puck assembly including a heater is mounted to the cooling plate. A simultaneous operation of the heater and a flow of coolant through the coolant channel regulates a temperature gradient across the puck assembly during a substrate processing operation.


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